Method and system for configurable antenna in an integrated circuit package

ABSTRACT

Aspects of a method and system for a configurable antenna in an integrated circuit package are provided. In a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, one or more antenna parameters may be adjusted by configuring a plurality of antenna elements via one or more switching elements. In this regard, the antenna elements and/or the switching elements may be within and/or on the multi-layer package and/or within the integrated circuit. The switching elements may be MEMS switches on and/or within the IC and/or the multi-layer package. The IC may be bonded or mounted to the underside of the package and signals may be communicated between the IC and the package via one or more solder balls. The IC may comprise suitable logic, circuitry, and/or code for configuring the antenna elements. The antenna elements may be configured based on desired polarization, antenna gain, and/or frequency.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

This patent application is a continuation of U.S. patent applicationSer. No. Serial No. 11/954,779 filed on Dec. 12, 2007.

The above stated application is hereby incorporated herein by referencein its entirety.

FIELD OF THE INVENTION

Certain embodiments of the invention relate to signal processing. Morespecifically, certain embodiments of the invention relate to a methodand system for a configurable antenna in an integrated circuit package.

BACKGROUND OF THE INVENTION

Mobile communications have changed the way people communicate and mobilephones have been transformed from a luxury item to an essential part ofevery day life. The use of mobile phones is today dictated, by socialsituations, rather than hampered by location or technology. While voiceconnections fulfill the basic need to communicate, and mobile voiceconnections continue to filter even further into the fabric of every daylife, the mobile Internet is the next step in the mobile communicationrevolution. The mobile Internet is poised to become a common source ofeveryday information, and easy, versatile mobile access to this datawill be taken for granted.

As the number of electronic devices enabled for wireline and/or mobilecommunications continues to increase, significant efforts exist withregard to making such devices more power efficient. For example, a largepercentage of communications devices are mobile wireless devices andthus often operate on battery power. Additionally, transmit and/orreceive circuitry within such mobile wireless devices often account fora significant portion of the power consumed within these devices.Moreover, in some conventional communication systems, transmittersand/or receivers are often power inefficient in comparison to otherblocks of the portable communication devices. Accordingly, thesetransmitters and/or receivers have a significant impact on battery lifefor these mobile wireless devices.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with some aspects of the present invention asset forth in the remainder of the present application with reference tothe drawings.

BRIEF SUMMARY OF THE INVENTION

A system and/or method is for a configurable antenna in an integratedcircuit package, substantially as shown in and/or described inconnection with at least one of the figures, as set forth morecompletely in the claims.

These and other advantages, aspects and novel features of the presentinvention, as well as details of an illustrated embodiment thereof, willbe more fully understood from the following description and drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is diagram illustrating a configurable antenna fabricated in anintegrated circuit package, in accordance with an embodiment of theinvention.

FIG. 2A is a diagram illustrating a cross sectional view of amulti-layer package with integrated configurable antenna, in accordancewith an embodiment of the invention.

FIG. 2B is a block diagram illustrating a cross sectional view of amulti-layer package with integrated configurable antenna, in accordancewith an embodiment of the invention.

FIG. 3 is a flow chart illustrating exemplary steps for receivingsignals utilizing a configurable integrated antenna, in accordance withan embodiment of the invention.

FIG. 4 is a block diagram illustrating an exemplary wireless device, inaccordance with an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Certain embodiments of the invention may be found in a method and systemfor a configurable antenna in an integrated circuit package. In a hybridcircuit comprising an integrated circuit bonded to a multi-layerpackage, one or more antenna parameters may be adjusted by configuring aplurality of antenna elements via one or more switching elements. Invarious exemplary embodiments of the invention, the antenna elementsand/or the switching elements may be within and/or on the multi-layerpackage and/or the within the integrated circuit. Additionally, invarious embodiments of the invention, the switching elements may be MEMSswitches on and/or within the IC and/or the multi-layer package. Also,in an exemplary embodiment of the invention, the IC may be bonded ormounted to the underside of the package and signals may be communicatedbetween the IC and the package via one or more solder balls. The IC maycomprise suitable logic, circuitry, and/or code for configuring theantenna elements. In various exemplary embodiments of the invention, theantenna elements may be configured based on desired polarization,antenna gain, and/or frequency. Furthermore, a first configuration ofsaid antenna elements may be utilized for receiving signals and a secondconfiguration of said antenna elements may be utilized for transmittingsignals. The multi-layer package may comprise one or more layers offerromagnetic and/or ferrimagnetic material.

FIG. 1 is diagram illustrating a configurable antenna fabricated in anintegrated circuit package, in accordance with an embodiment of theinvention. Referring to FIG. 1, there is shown a hybrid circuit 200 (Thehybrid circuit may also be referred to as a hybridized circuit, or ahybrid or hybridized package.) comprising a multi-layer integratedcircuit (IC) package 213, an associated IC (“chip”) 201, antennaelements 102, switching elements 104, and solder balls 211.

The IC 201 may comprise suitable logic, circuitry, and/or code forperforming one or more functions associated with transmitting and/orreceiving RF signals. In this regard, the IC 201 may comprise all or aportion of the system 420 described with respect to FIG. 4. In thisregard, the IC may utilize a configurable antenna fabricated in themulti-layer integrated circuit package 213 for transmitting and/orreceiving RF signals. In this regard, the IC 201 may comprise suitablelogic, circuitry and/or code for configuring the antenna elements 102via the switching elements 104.

The IC 201 may be bump-bonded or flip-chip bonded to the multi-layer ICpackage 213 utilizing the solder balls 211. In this manner, wire bondsconnecting the IC 201 to the multi-layer IC package 213 may beeliminated, reducing and/or eliminating uncontrollable stray inductancesdue to wire bonds. In addition, the thermal conductance out of the IC201 may be greatly improved utilizing the solder balls 211 and thethermal epoxy 221. The thermal epoxy 221 may be electrically insulatingbut thermally conductive to allow for thermal energy to be conducted outof the IC 201 to the much larger thermal mass of the multilayer package213.

The solder balls 211 may comprise spherical balls of metal to provideelectrical, thermal and physical contact between the IC 201 and themulti-layer IC package 213. In making the contact with the solder balls211, the IC may be pressed with enough force to squash the metal spheressomewhat, and may be performed at an elevated temperature to providesuitable electrical resistance and physical bond strength. The solderballs 211 may also be utilized to provide electrical, thermal andphysical contact between the multi-layer IC package 213 and a printedcircuit board comprising other parts of, for example, the wirelesssystem 420 described with respect to FIG. 4.

The multi-layer IC package 213 may comprise one or more layers of metaland/or insulating material. In this regard, the package 213 may befabricated in a manner similar to or the same as the IC 201.Accordingly, the layers may be utilized to realize circuit exemplaryelements comprising resistors, inductors, capacitors, transmissionlines, switches, and antennas. In various embodiments of the invention,one or more switching elements 104 and one or more antenna elements 102may be fabricated in the multi-layer IC package 213. Accordingly, aconfigurable antenna may be realized in the multi-layer IC package 213wherein opening/closing the switches alters the receive characteristicsof the antenna.

The antenna elements 102 may each be a metallic and/or conductivestructure capable of coupling RF energy to/from, for example, thetransceiver 423 described with respect to FIG. 420. The antenna elements102 may be coupled, via switches 104, to form an overall antenna whichmay thus have a variety of shapes and sizes. In this manner, controllingthe shape and size of the overall antenna may enable controllingexemplary characteristics of the antenna comprising center frequency,bandwidth, gain, and polarization. In various embodiments of theinvention, each element may be rectangular, circular, and/or anothershape. One or more of the elements may be coupled (by way of one or morevias and/or one or more metal layers) to one or more of the solder balls211. In this manner, signals may be conveyed to/from the package 213.

The switching elements 104 may enable coupling/decoupling the antennaelements 102 from each other and/or one or more solder balls 211 thusaltering the size and shape of the overall antenna. In variousembodiments of the invention, the switching elements 104 may bemicro-electro-mechanical (MEMS) switches.

In operation, suitable logic, circuitry, and/or code in the IC 201 andor in another device coupled to the package 213 (e.g., located on a PCBand coupled via one or more of the solder balls 211) may control theswitching elements 104 to realize a desired antenna characteristic. Inthis regard, the antenna elements 102 may be coupled/decoupled such thatthe shape and/or size of the overall antenna achieves a desired gain,center frequency, bandwidth, polarization, etc.

FIG. 2A is a diagram illustrating a cross sectional view of amulti-layer IC package with integrated configurable antenna, inaccordance with an embodiment of the invention. Referring to FIG. 2,there is shown a hybrid circuit 200 comprising a IC 201 and amulti-layer IC package 213. The multi-layer IC package 213 may comprisean insulating material 203, metal layers 202 and 206, vias 204, and MEMSswitches 220 a, 220 b, and 220 c. Additionally, in various embodimentsof the invention, the multi-layer IC package may comprise one or morelayers and/or areas of ferromagnetic and/or ferromagnetic material. TheIC 210 may be coupled to the package 213, and the package 213 to a PCB(not shown), via solder balls 211. A surface mount component 219 may bemounted to the package 213, and thermal epoxy 221 may be pressed betweenthe IC 201 and the package 213.

The IC 201 may be as described with respect to FIG. 1.

The solder balls 211 may be as described with respect to FIG. 1.

The surface mount device 219A may comprise a discrete circuit elementsuch as resistors, capacitors, inductors, and diodes, for example. Thesurface mount device 219A may be soldered to the IC package 213 toprovide electrical contact. In various embodiments of the invention,additional surface mount elements or no surface mount elements may becoupled to the package 213.

In an exemplary embodiment of the invention, the metal layer 202, maycomprise a deposited metal layer utilized to delineate the antennaelements 102 described with respect to FIG. 1. In this regard, the metallayer 202 may be deposited in shapes and/or sizes which enable varyingcharacteristics of the overall antenna characteristics (e.g., centerfrequency, bandwidth, gain, polarization).

In an exemplary embodiment of the invention, the vias 204 and the metallayer 206 may comprise deposited metal layers utilized to delineatewaveguides, traces, and/or transmission lines which may couple the metallayer 202 to the solder balls 211. In this manner, signals may beconveyed to/from the antenna elements 102 in the metal layer 202.

In an exemplary embodiment of the invention, one or more MEMS switches220 may be realized in the multi-layer IC package 213. In this regard,the MEMS switch 220 may close when, for example a magnetic field isinduced on a switch terminal. In this regard, the MEMS switches 220 mayeach comprise a thin conductive element or film which when in the openposition is suspended above a switch terminal (as indicated by the solidlines in FIG. 2) and when in the closed position is in contact with aswitch terminal (as indicated by the dashed lines in FIG. 2).Accordingly, energizing the terminal, for example, may generate anattracting force that draws the element of film into contact with theterminal.

In operation, the IC 201 and associated package 213 may be utilized totransmit and/or receive RF signals. The IC 201 may be electricallycoupled to a configurable antenna fabricated on and/or within the ICpackage 213. The overall antenna response may be configured via theswitching elements 220. In this regard, each antenna element 102 maytransmit and/or receive RF energy and that energy may be coupled to oneof the solder balls 211 when a corresponding switch 220 is in the closedposition. In this manner, logic, circuitry, and/or code in the IC 201may select whether to utilize the antenna element 102 a, 102 b, and/or102 c, by closing switch 220 a, 220 b, and 220 c, respectively.Accordingly, selecting the different combinations of the antennaelements 102 may enable achieving overall antenna characteristics. Invarious embodiments of the invention, additional devices (e.g.,capacitors, inductors, resistors) may be integrated into the multi-layerIC package without deviating from the scope of the present invention.

In an exemplary embodiment of the invention, one or more circuit values(e.g., capacitance or inductance) may be adjusted and/or tuned via thesurface mount devices. For example, a MEMS switch 220 may enablecoupling or decoupling the surface mount devices to the IC 210. Invarious other embodiments of the invention, additional MEMS switches maybe integrated in the multi-layer IC package 213 and may be utilized forcoupling/decoupling integrated and/or surface mount components within/onthe multi-layer IC package to other components within/on the package 213and/or to the IC 210. Additionally, switching elements in the IC 210 maybe utilized for coupling devices within the IC 210, within themulti-layer IC package 213, and between the multi-layer IC package 213and the IC 210.

FIG. 2B is a block diagram illustrating a cross sectional view of amulti-layer IC package with integrated configurable antenna, inaccordance with an embodiment of the invention. Referring to FIG. 2Bthere is shown an IC 201 and associated package 213. The package 213 maycomprise an insulating material 203, a metal layer 202, vias 252, 254,256, and MEMS switches 220 d and 220 e. The IC 210 may be coupled to thepackage 213, and the package 213 to a PCB (not shown), via solder balls211. A surface mount component 219 may be mounted to the package 213,and thermal epoxy 221 may be pressed between the IC 201 and the package213.

The IC 201 may be as described with respect to FIG. 2A.

The multi-layer IC package 213 may be as described with respect to FIG.1.

Antenna elements 102 a, 102 b, 102 c may be fabricated in the metallayer 202. In this regard, the elements 102 a, 102 b, 102 c may be asdescribed with respect to FIG. 1. The antenna elements 102 a, 102 b, and102 c may be coupled and/or decoupled via the MEMS switches 220 d and220 e.

The vias 252 and 255 may convey biasing and or control signals to theantenna elements 102 a and 102 c, respectively. Accordingly, the MEMSswitches may be controlled by way of the vias 252 and 256. In oneexemplary configuration, a magnetic charge may be induced on the antennaelement 102 a which may close (indicated by the dashed line) the MEMSswitch 220 a. In this manner, the overall antenna may comprise antennaelements 102 a and 102 b. In another configuration, both switches 220 dand 220 e may be closed such that the overall antenna comprises antennaelements 102 a, 102 b, and 102 c.

The via 254 may convey received RF signals from the overall antenna orRF signals to be transmitted to the overall antenna. In this regard, theconfiguration of the MEMS switches 202 d and 202 e may alter the size,shape, polarization, etc. of the overall antenna and thus affect thereception/transmission characteristics of the antenna. For example, bothMEMS switches 220 d and 220 e closed may improve antenna response atlower frequencies whereas both MEMS switches 220 d and 220 e open mayimprove antenna response at higher frequencies. Accordingly, selectingdifferent combinations of the antenna elements 102 may enable achievingdifferent antenna characteristics.

FIG. 3 is a flow chart illustrating exemplary steps for receivingsignals utilizing a configurable integrated antenna, in accordance withan embodiment of the invention. Referring to FIG. 3 the exemplary stepsmay begin with step 302 when a receiver is ready to begin receivingsignals. Subsequent to step 302, the exemplary steps may advance to step304. In step 304, a counter, i, may be initialized to 0. In this regard,i may keep track of antenna configurations, and each combination of openand closed switches may correspond to a value of i. Accordingly, highernumbers of antenna elements and higher number of switches may correspondto a higher maximum value of i. Subsequent to step 304, the exemplarysteps may advance to step 306.

In step 306, switch elements (e.g., 104 of FIG. 1, or 220 of FIG. 2A and2B) may be placed in a configuration which corresponds to the currentvalue of i. In this regard, a memory (e.g. 427 of FIG. 4) may beutilized to map i to switch configurations. Subsequent to step 306, theexemplary steps may advance to step 308.

In step 308, a receiver (e.g. 423 of FIG. 4) may receive signalsutilizing the antenna configuration corresponding to the current valueof i. The transceiver may then measure the received signal (e.g.,strength, signal to noise, presence of interference, etc.) and storeresults of the measurement to a memory (e.g. 427 of FIG. 4). Subsequentto step 308, the exemplary steps may advance to step 310.

In step 310, i may be incremented. Subsequent to step 310, the exemplarysteps may advance to step 312. In step 312, it may be determined whetheri is equal to a maximum value of i. In this regard, checking to see if iis equal to a maximum value may enable determining if all desiredantenna configurations have been tried. For example, i may be equal tothe total number of possible antenna configurations (which depends onthe number of antenna elements and the number of switches).Alternatively, a subset of possible antenna configurations may be triedwhere, for example, it was previously determined that thoseconfigurations are most likely to provide the best reception. Subsequentto step 312, the exemplary steps may advance to step 314.

In step 314, it may be determined which value of i (i.e. which antennaconfiguration) resulted in the best reception. In this regard, invarious embodiments of the invention, the antenna may be configured uponpower up, upon changing a channel or frequency, when received signalstrength drops below a threshold, periodically, etc. Subsequent to step314, the exemplary steps may advance to step 316. In step 316, thedetermined best antenna configuration may be selected and signals may bereceived.

Steps similar to those described with respect to FIG. 3 may also beapplied to determining an antenna configuration for transmittingsignals.

FIG. 4 is a block diagram illustrating an exemplary wireless device, inaccordance with an embodiment of the invention. Referring to FIG. 4,there is shown a wireless device 420 that may comprise an RF receiver423 a, an RF transmitter 423 b, a digital baseband processor 429, aprocessor 425, and a memory 427. A receive antenna 421 a may becommunicatively coupled to the RF receiver 423 a. A transmit antenna 421b may be communicatively coupled to the RF transmitter 423 b. Thewireless device 420 may be operated in a system, such as the cellularnetwork and/or digital video broadcast network, for example.

The antenna(s) 421 a and 421 b may comprise one or more antennaelements, similar to or the same as the antenna elements 102 describedwith respect to FIG. 1, which may be coupled/decoupled via one or moreswitching elements, such as the MEMS switches 220 described with respectto FIG. 2A, 2B. In this regard, the antennas 421 a and 421 b may shareantenna elements and/or utilize different elements. For example, antenna421 a and 421 b may utilize mutually exclusive antenna elements andswitches which may enable simultaneous transmission and reception.Alternatively, a first configuration of antenna elements may be utilizedto receive signals and a second configuration of antenna elements may beutilized to transmit signals, wherein one or more antenna elements isutilized in both the transmit and receive configurations.

The RF receiver 423 a may comprise suitable logic, circuitry, and/orcode that may enable processing of received RF signals. The RF receiver423 a may enable receiving RF signals in a plurality of frequency bands.For example, the RF receiver 423 a may enable receiving signals inextremely high frequency (e.g., 60 GHz) bands. The receiver 423 a may beenabled to receive, filter, amplify, down-convert, and/or perform analogto digital conversion. The RF receiver 423 a may down convert a receivedRF signal. In this regard, the RF receiver 423 a may perform direct downconversion of the received RF signal to a baseband or may convert thereceived RF signal to an intermediate frequency (IF). In variousembodiments of the invention, the receiver 423 a may perform quadraturedown-conversion where in-phase components and quadrature phasecomponents may be processed in parallel. The receiver 423 a may beenabled to receive signals via the antenna 421 a, which may be aconfigurable integrated antenna as described with respect to FIGS. 1,2A, and 2B. In various embodiments of the invention, the wireless device420 may comprise a plurality of the receivers 423 a and may thus supportmultiple frequency bands and or simultaneous reception of signals in thesame frequency band.

The digital baseband processor 429 may comprise suitable logic,circuitry, and/or code that may enable processing and/or handling ofbaseband signals. In this regard, the digital baseband processor 429 mayprocess or handle signals received from the RF receiver 423 a and/orsignals to be transferred to the RF transmitter 423 b, when the RFtransmitter 423 b is present, for transmission to the network. Thedigital baseband processor 429 may also provide control and/or feedbackinformation to the RF receiver 423 a and to the RF transmitter 423 bbased on information from the processed signals. In this regard, thebaseband processor 429 may provide one or more control signals forconfiguring the antenna elements, via one or more switching elements, torealize the receive antenna 421 a and/or the transmit antenna 421 b. Thedigital baseband processor 429 may communicate information and/or datafrom the processed signals to the processor 425 and/or to the memory427. Moreover, the digital baseband processor 429 may receiveinformation from the processor 425 and/or to the memory 427, which maybe processed and transferred to the RF transmitter 423 b fortransmission to the network.

The RF transmitter 423 b may comprise suitable logic, circuitry, and/orcode that may enable processing of RF signals for transmission. Thetransmitter 423 b may be enabled to transmit signals via the antenna 421b, which may be a configurable integrated antenna as described withrespect to FIGS. 1, 2A, and 2B. The RF transmitter 423 b may enabletransmission of RF signals in a plurality of frequency bands. Forexample, the RF transmitter 423 b may enable transmitting signals incellular frequency bands. Each frequency band supported by the RFtransmitter 423 b may have a corresponding front-end circuit forhandling amplification and up conversion operations, for example. Inthis regard, the RF transmitter 423 b may be referred to as a multi-bandtransmitter when it supports more than one frequency band. In anotherembodiment of the invention, the wireless device 420 may comprise morethan one RF transmitter 423 b, wherein each of the RF transmitter 423 bmay be a single-band or a multi-band transmitter.

In various embodiments of the invention, the RF transmitter 423 b mayperform direct up conversion of the baseband signal to an RF signal. Insome instances, the RF transmitter 423 b may enable digital-to-analogconversion of the baseband signal components received from the digitalbaseband processor 429 before up conversion. In other instances, the RFtransmitter 423 b may receive baseband signal components in analog form.

The processor 425 may comprise suitable logic, circuitry, and/or codethat may enable control and/or data processing operations for thewireless device 420. The processor 425 may be utilized to control atleast a portion of the RF receiver 423 a, the RF transmitter 423 b, thedigital baseband processor 429, and/or the memory 427. In this regard,the processor 425 may generate at least one signal for controllingoperations within the wireless device 420. In this regard, the basebandprocessor 429 may provide one or more control signals for configuringthe antenna elements, via one or more switching elements, to realize thereceive antenna 421 a and/or the transmit antenna 421 b. The processor425 may also enable executing of applications that may be utilized bythe wireless device 420. For example, the processor 425 may executeapplications that may enable displaying and/or interacting with contentreceived via cellular transmission signals in the wireless device 420.

The memory 427 may comprise suitable logic, circuitry, and/or code thatmay enable storage of data and/or other information utilized by thewireless device 420. For example, the memory 427 may be utilized forstoring processed data generated by the digital baseband processor 429and/or the processor 425. The memory 427 may also be utilized to storeinformation, such as configuration information, that may be utilized tocontrol the operation of at least one block in the wireless device 420.For example, the memory 427 may comprise information necessary toconfigure the antenna(s) 421 a and 421 b In this regard, the memory maystore control and/or configuration information for configuring theantenna elements, via one or more switching elements, to realize thereceive antenna 421 a and/or the transmit antenna 421 b.

Aspects of a method and system for configurable antenna in an integratedcircuit package are provided. In a hybrid circuit (e.g., 200) comprisingan integrated circuit (e.g., 201) bonded to a multi-layer package (e.g.,213), one or more antenna parameters may be adjusted by configuring aplurality of antenna elements (e.g., 102) via one or more switchingelements (e.g., 104). In various exemplary embodiments of the invention,the antenna elements and/or the switching elements may be within theintegrated circuit and/or within and/or on the multi-layer package.Also, the switching elements may be MEMS switches (e.g., 220) on and/orwithin the IC and/or the multi-layer package. The IC may be bonded ormounted to the underside of the package and signals may be communicatedbetween the IC and the package via one or more solder balls (e.g., 211).The IC may comprise suitable logic, circuitry, and/or code forconfiguring the antenna elements. The antenna elements may be configuredbased on desired polarization, antenna gain, and/or frequency. A firstconfiguration of said antenna elements may be utilized for receivingsignals and a second configuration of said antenna elements may beutilized for transmitting signals. The multi-layer package may compriseone or more layers of ferromagnetic and/or ferrimagnetic material.

Another embodiment of the invention may provide a machine-readablestorage, having stored thereon, a computer program having at least onecode section executable by a machine, thereby causing the machine toperform the steps as described herein for configurable antenna in anintegrated circuit package.

Accordingly, the present invention may be realized in hardware,software, or a combination of hardware and software. The presentinvention may be realized in a centralized fashion in at least onecomputer system, or in a distributed fashion where different elementsare spread across several interconnected computer systems. Any kind ofcomputer system or other apparatus adapted for carrying out the methodsdescribed herein is suited. A typical combination of hardware andsoftware may be a general-purpose computer system with a computerprogram that, when being loaded and executed, controls the computersystem such that it carries out the methods described herein.

The present invention may also be embedded in a computer programproduct, which comprises all the features enabling the implementation ofthe methods described herein, and which when loaded in a computer systemis able to carry out these methods. Computer program in the presentcontext means any expression, in any language, code or notation, of aset of instructions intended to cause a system having an informationprocessing capability to perform a particular function either directlyor after either or both of the following: a) conversion to anotherlanguage, code or notation; b) reproduction in a different materialform.

While the present invention has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the present invention. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the present invention without departing from its scope.Therefore, it is intended that the present invention not be limited tothe particular embodiment disclosed, but that the present invention willinclude all embodiments falling within the scope of the appended claims.

1-20. (canceled)
 21. A method comprising: in an integrated circuitbonded to an integrated circuit package, wherein a plurality of antennaelements are realized within and/or on said integrated circuit package:selecting a first one or more of said plurality of antenna elements toutilize as a first antenna; selecting a second one or more of saidplurality of elements to utilize as a second antenna; and communicatingsignals via one or both of said first antenna and said second antenna.22. The method according to claim 21, wherein said communicatingcomprises: communicating a first signal via said first antenna; andcommunicating a second signal via said second antenna.
 23. The methodaccording to claim 1, wherein each of a plurality of phases of saidfirst signal is communicated via one of said first one or more antennaelements.
 24. The method according to claim 22, wherein: said selectingof said first one or more antenna elements is based on a frequency ofsaid first one or more signals; and said selecting of said second one ormore antenna elements is based on a frequency of said second one or moresignals.
 25. The method according to claim 21, wherein: said selectingof said first one or more antenna elements is based on a desiredpolarization of said first antenna; and said selecting of said secondone or more antenna elements is based on a desired polarization of saidsecond antenna.
 26. The method according to claim 21, wherein: saidselecting of said first one or more antenna elements is based on adesired antenna gain of said first antenna; and said selecting of saidsecond one or more antenna elements is based on a desired antenna gainof said second antenna.
 27. The method according to claim 21, whereinsaid selecting of said first one or antenna elements and said selectingof said second one or more antenna elements is accomplished utilizingone or more microelectromechanical switches realized in said integratedcircuit package.
 28. The method according to claim 21, wherein saidcommunicating comprises concurrently transmitting via both of said firstantenna and said second antenna.
 29. The method according to claim 21,wherein said communicating comprises concurrently receiving via both ofsaid first antenna and said second antenna.
 30. The method according toclaim 21, wherein said communicating comprises transmitting one of saidfirst antenna and said second antenna while concurrently receiving viathe other of said first antenna and said second antenna.
 31. A systemcomprising: one or more circuits in an integrated circuit bonded to anintegrated circuit package, wherein a plurality of antenna elements arerealized within and/or on said integrated circuit package, and said oneor more circuits are operable to: select a first one or more of saidplurality of antenna elements to utilize as a first antenna; select asecond one or more of said plurality of elements to utilize as a secondantenna; and communicate signals via one or both of said first antennaand said second antenna.
 32. The system according to claim 21, whereinsaid communicating comprises: communicating a first signal via saidfirst antenna; and communicating a second signal via said secondantenna.
 33. The system according to claim 1, wherein each of aplurality of phases of said first signal is communicated via one of saidfirst one or more antenna elements.
 34. The system according to claim22, wherein: said selecting of said first one or more antenna elementsis based on a frequency of said first one or more signals; and saidselecting of said second one or more antenna elements is based on afrequency of said second one or more signals.
 35. The system accordingto claim 21, wherein: said selecting of said first one or more antennaelements is based on a desired polarization of said first antenna; andsaid selecting of said second one or more antenna elements is based on adesired polarization of said second antenna.
 36. The system according toclaim 21, wherein: said selecting of said first one or more antennaelements is based on a desired antenna gain of said first antenna; andsaid selecting of said second one or more antenna elements is based on adesired antenna gain of said second antenna.
 37. The system according toclaim 21, wherein said selecting of said first one or antenna elementsand said selecting of said second one or more antenna elements isaccomplished utilizing one or more microelectromechanical switchesrealized in said integrated circuit package.
 38. The system according toclaim 21, wherein said communicating comprises concurrently transmittingvia both of said first antenna and said second antenna.
 39. The systemaccording to claim 21, wherein said communicating comprises concurrentlyreceiving via both of said first antenna and said second antenna. 40.The system according to claim 21, wherein said communicating comprisestransmitting one of said first antenna and said second antenna whileconcurrently receiving via the other of said first antenna and saidsecond antenna.